Large Aluminum Heat Sink Plate Electronic Devices

Large Aluminum Heat Sink Plate Electronic Devices

Description: Large Aluminum Heat Sink
Material: alloy steel
Size: Height/Length: customized
Surface treatment: hot dip galvanization
Process: Tapping, bending, electroplating, riveting
Finish: Smooth
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Description

Description

Large Aluminum Heat Sink

Material

alloy steel

Size

Height/Length: customized

Logo

Beray or the logo you want

Color

silver or whatever you want

Surface treatment

hot dip galvanization

Process

Tapping, bending, electroplating, riveting

Finish

Smooth

Delivery time

25days for one container (around 18-25tons)

Shipping way

By Sea in big quantity or by air in small quantity

Payment

T/T, L/C, or others

Item Weight

Customization according to actual weight

Product Advantages

 

1. Superior Thermal Conductivity: Aluminum alloy boasts a thermal conductivity of up to 150-200 W/m·K (depending on the alloy type, such as 6061-T6, 6063, etc.), significantly improving heat dissipation efficiency compared to common metals.

 

2. Lightweight Design: Approximately 30%-70% lighter than copper, reducing structural load and making it suitable for lightweight cabinets or space-constrained applications.

 

3. Cost-Effective: Compared to copper, aluminum alloy offers lower material costs and greater processing flexibility, making it suitable for medium- and large-volume custom production.

 

4. Customizable Design: The Large Aluminum Heat Sink supports customizable dimensions, hole placement, through-hole layout, and surface color, allowing for flexible design to fit device configurations and adapt to a wide range of electronic devices. Large Aluminum Heat Sink Plate Electronic Devices

 

Processing Technology

 

1. Extrusion: Suitable for large aluminum heat sinks with regular fin or fin structures. This extrusion process creates a single-step process, resulting in a stable structure and fast heat exchange.

 

2. Milling: For custom sizes or placement requirements, CNC milling machines are used for precision cutting, achieving high precision. Designing large aluminum heat sink plates for electronic devices is not difficult for us, but its practical value far outweighs the cost.

 

3. Skiving (Bonded Fins): Used to create high-density fin structures, increasing the heat dissipation surface area and air contact efficiency.

 

Surface Treatment

 

1. Anodizing: Anodized surfaces, such as black and silver, are commonly used. They are aesthetically pleasing and corrosion-resistant, while also improving radiative heat dissipation.

 

2. Sandblasting or Polishing: Improves surface smoothness and texture. Sandblasting increases the surface area of the heat dissipation microstructure, enhancing heat dissipation. Polishing is suitable for smooth installation.

 

3. Special Functional Treatment: Laser modification or oxidation micro-texture surface treatment can be used to enhance heat dissipation efficiency and durability (optional).

 

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Contact Us
  • ATTN: Fiona (Sales Manager)
  • Email: sales01@beray-metal.com
  • Add: 9-89-11, Building 017, No.128 Huizhan Road, Yinzhou District, Ningbo City, Zhejiang Province

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